The world’s largest IC packaging and testing service provider, ASE Technology Holding Co., has introduced advanced packaging solutions for chiplets that are targeted for use in artificial intelligence, automotive electronics, high performance computing devices and 5G applications.
The company said Friday that subsidiary Advanced Semiconductor Engineering has unveiled the industry’ first Fan-Out Chip on Substrate Chip First (FOCoS-CF) with encapsulant-separated redistribution layer (RDL) and Chip Last (FOCoS-CL) semiconductor packaging technologies.
ASE said this progression of fan-out technology offers a breakthrough in reliability and exceptional electrical performance while meeting integration requirements for networking and AI applications that demand greater memory and computing power.
The market’s growing demand for high density, high speed and low latency is driving a new level of packaging innovations, such as FOCoS-CF and FOCoS-CL solutions, according to ASE, and it said its new line of chiplets can address the limitations of traditional flip-chip packages.
Compared to a single System on Chip (SoC) assembled on a substrate, the new chiplets use multi-chip and chiplet integration that reconstitute two or more chips into a fan-out module that is then assembled on a substrate, the company said.
ASE announced last week a net profit for the third quarter of NT$17.47 billion (US$543 million), up 9 percent from a quarter earlier and up 23 percent from a year earlier, with earnings per share at NT$4.03.
Despite the higher third quarter earnings, ASE has lowered its capital expenditure by 10 percent for 2022 amid weakness in the global semiconductor industry.
Hit by stagnant consumer demand for electronic gadgets, end users of semiconductors have been drawing down IC inventories built up over the past 18 months and held back on orders for new shipments, leading semiconductor vendors to more cautious in their expansion plans.
ASE has said it expects inventory adjustments to continue into the first half of next year.
Source: Focus Taiwan News Channel