Asean

YYForce Secures S$15.96 Million in New Multi-Year Singapore Facility Services Contracts

New awards expand contracted business visibility across YYForce’s Singapore integrated facility management operations, with all contracts commencing in October 2026 and principal service periods extending approximately three years SINGAPORE, Sept. 29, 2026 (GLOBE NEWSWIRE) — YYForce Inc. (Nasdaq: YFOR) (“YYForce” or the “Company”), an AI-enabled workforce management and integrated facility

ProductLife Group completes its transformation into a single, unified group with an end-to-end set of human and digital capabilities across life sciences

The consolidation of 26 businesses, acquired over six years, into one identity — now expressed through a new brand: PLG | Advanced Intelligence for Life Sciences PLG | Advanced Intelligence for Life Sciences PARIS, Sept. 29, 2026 (GLOBE NEWSWIRE) — ProductLife Group (PLG) today completes a multi-year transformation, uniting the

ERS electronic Unveils Fully Automated 310 x 310 mm Panel-Level Packaging System to Power AI and Chiplet Architectures

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, today announced its fully automated panel-level packaging (PLP) system for 310×310 mm substrates. The machine integrates temporary carrier bonding, debonding, and detaping into a single automated platform at 13 panels per hour, eliminating inter-tool transfers across three thermally

ERS electronic Unveils Fully Automated 310 x 310 mm Panel-Level Packaging System to Power AI and Chiplet Architectures

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, today announced its fully automated panel-level packaging (PLP) system for 310×310 mm substrates. The machine integrates temporary carrier bonding, debonding, and detaping into a single automated platform at 13 panels per hour, eliminating inter-tool transfers across three thermally