Sport climbing medal hopeful Lee Do-hyun won't compete for a spot on the podium at the Paris Olympics, after being eliminated in the semifinal of the men's combined event Wednesday. Lee finished 17th in the lead semifinal at Le Bourget Sport Climbing Venue in Le Bourget, north of Paris, after earning 12.0 points. He had been 10th after the bouldering semifinal Monday with 34.0 points. At 46.0 points combined, Lee finished 15th overall among 20 climbers in the semifinal, with the top eight moving on to the final. Sorato Anraku of Japan, world No. 1 in both bouldering and lead, finished first with 137.0 points overall. He had 69.0 points in bouldering and 68.0 points in lead. In lead climbing, athletes get one attempt to ascend as high as they can on a route set on a 15-meter wall within six minutes. And Lee fell from the wall early, unable to make up ground after a poor showing in bouldering. Lee is world No. 3 in bouldering and No. 10 in lead. "Physically, I felt fine. There was a spot where other clim bers had fallen from, and I dropped from the same spot," Lee said. "I should have concentrated harder." Lee, the 2023 Asian Games silver medalist, was competing at his first Olympics. "I am disappointed that I didn't get to show everything I had at the Olympics," the 21-year-old said. "I had been enjoying this competition until I fell. I will try to be back even stronger." Source: Yonhap News Agency
(Olympics) Sport climbing medal hopeful misses final in combined event
Recent News
Lin Chung-wei Wins Bronze in Men’s 400-Meter Hurdles at Asian Games
September 28, 2026
Taiwan Secures 33 Medals at 2026 Aichi-Nagoya Asian Games
September 28, 2026
Fu Chao-hsuan Wins Historic Gold in High Jump at Asian Games
September 28, 2026
East Asia Super League 2026-27 Season to Open in Cebu
September 28, 2026
Taiwanese Tech Firms Host Major Recruitment Event in Silicon Valley
September 28, 2026
Morocco Resumes Visa Applications for Taiwanese Tourists
September 28, 2026
Taiwan’s VIS and NXP Semiconductors Begin Production at Singapore Chip Plant
September 28, 2026