Taipei: Siliconware Precision Industries Co. (SPIL) on Tuesday broke ground on a NT$100 billion (US$3.11 billion) Chip-on-Wafer-on-Substrate (CoWoS) plant in Yunlin County to package and test artificial intelligence (AI) chips. At a groundbreaking ceremony, SPIL Vice Chairman Chang Yen-chun highlighted that the 6-hectare site at Yunlin Technology Industrial Park in Douliu City will complement facilities the company has expanded in Taichung, Changhua, Yunlin, and Tainan amid booming demand for AI.

According to Focus Taiwan, Chang stated that the first phase of the Douliu plant is scheduled to begin operations in 2028, with the entire investment expected to create 2,200 new jobs in Yunlin. The vice chairman also mentioned that another SPIL plant in Huwei Township, Yunlin, which was inaugurated in September 2025, had entered commercial production and begun generating profits.

Minister of Economic Affairs Kung Ming-hsin, present at the ceremony, emphasized SPIL's role as a technological leader. Kung noted that SPIL had become one of the partners in U.S. tech giant Advanced Micro Devices Inc.'s (AMD's) plan to invest more than US$100 billion into Taiwan's AI supply chain ecosystem, as announced in May.

According to AMD, the project will involve expanding partnerships with Taiwanese companies engaged in chip packaging, substrates, and server manufacturing, including SPIL, ASE Technology, and contract chipmaker Taiwan Semiconductor Manufacturing Co.

On Monday, the board of SPIL approved a plan to conduct a rights issue of up to 809.7 million new shares at NT$20 per share to raise NT$16.19 billion for purchasing production materials. Additionally, fellow ASE Technology subsidiary Advanced Semiconductor Engineering Inc. has announced an 809.7 million share issue to raise NT$16.19 billion. ASE Technology, the world's largest provider of IC packaging and testing services, stated it will subscribe to all of the new shares issued by its two subsidiaries.