Santa Clara: Taiwan Semiconductor Manufacturing Co. (TSMC) on Wednesday unveiled a slew of advanced technologies at its North America Technology Symposium in California, with a focus on its next-generation artificial intelligence (AI) chips. TSMC Chairman C.C. Wei hosted the opening ceremony in Santa Clara for the company's flagship customer event of the year, which drew registrations from more than 2,500 attendees.

According to Focus Taiwan, TSMC announced that the A14 logic process technology represents a significant advancement from its industry-leading N2 process. This new technology is designed to drive AI transformation by delivering faster computing and greater power efficiency. TSMC's current A14 development is progressing smoothly, with its yield performance ahead of schedule, and the process is expected to enter production in 2028.

TSMC stated that compared to the N2 process, which is about to enter volume production later this year, the A14 could offer up to a 15 percent speed improvement at the same power level, or it could reduce power consumption by up to 30 percent at the same speed. Additionally, the company is advancing its Chip on Wafer on Substrate (CoWoS) technology for high-performance computing applications to address AI's enormous need for more logic and high-bandwidth memory (HBM).

The company also plans to bring its 9.5 reticle size CoWoS to volume production in 2027. After showcasing its revolutionary System-on-Wafer (SoW) technology in 2024, TSMC unveiled its SoW-X, a CoWoS-based platform to create a wafer-sized system with computing power 40 times greater than the current CoWoS solution, with mass production planned for 2027.

TSMC also debuted new logic, specialty, advanced packaging, and 3D chip stacking technologies, which will contribute to broad technology platforms for high-performance computing (HPC), smartphones, automotive, and the Internet of Things (IoT). These include the N4C RF, the latest generation of TSMC's radio frequency technology, designed to meet the requirements of emerging standards such as WiFi8 and AI-enabled True Wireless Stereo platforms. The N4C RF is scheduled to enter risk production in the first quarter of 2026, according to the company.